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  • Short Circuits

    Staff -- Purchasing, 4/15/2004 2:00:00 AM

    TI moves to 65 nm

    Texas Instruments says it will move to 65-nanometer process technology next year, which will shrink current chip designs by half and boost performance.

    TI says the new 65-nanometer process will reduce the size of equivalent designs on the 90-nanometer process by half while increasing transistor performance by 40%. TI will begin the transition in the first quarter. Full production on the new process is expected in late 2005.

    Avnet gets IBM ASICs

    Avnet and IBM have extended a distribution agreement to include IBM application specific integrated circuit (ASIC) devices and technology in North America.

    Under the agreement, Avnet, through its Avnet Cilicon division, will provide engineering design services to customers to help accelerate the adoption of IBM ASIC products.

    The agreement covers ASIC products and technologies from IBM at the 0.18 micron and 0.25 micron technology nodes.

    Avnet Cilicon will also provide sales and marketing support for IBM ASIC products to its large distribution customer base.

    This agreement marks the first time that IBM has opened up its ASIC design methodologies for execution by a channel business partner.

    Digi-Key adds TI to roster

    Digi-Key has signed an agreement with Analog Devices (ADI) that allows Digi-Key to distribute Analog Devices products in the Americas.

    Digi-Key now stocks a full line of ADI's product offerings, including analog ICs, digital signal processors (DSPs) and micro-electromechanical system (MEMS) products. These products are in stock and available for immediate shipment.

    "We are delighted to be able to offer a broad range of Analog Devices products to our customers," said Mark Larson, Digi-Key president. "With our industry-leading customer service and our commitment to inventory Analog Devices products, we are able to meet both the prototype and design requirements, as well as the volume production needs of our customers.

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