Qimonda moves more production to 300mm wafers
By James Carbone -- Purchasing, 1/17/2008 2:00:00 AM
Memory IC manufacturer Qimonda says it will transition more DRAM manufacturing from 200mm wafers to 300mm wafers, adding that the share of its 300mm capacity will reach 90% by the end of the current fiscal year. At its Richmond, Va., facility the number of 200mm wafer starts will be reduced by approximately 15% as it switches from 110nm process technology to 80nm technology. At its Dresden, Germany site, Qimonda will discontinue the contract manufacturing of 200mm Qimonda products by Infineon Dresden.
Talkback
DRAM capital spending declines 56%
04/14/2009CHIPS FROM ABROAD
06/03/1998Micron to buy Numonyx
03/12/2010
Sponsored Links
Now Playing: 