Clip-chip alliance formed

By James Carbone -- Purchasing, 3/26/1998

Three companies have formed a partnership to develop flip-chip packaging of integrated passive components and qualify them for use in full-scale production. The goal of the partnership is to develop flip-chip IPCs which can be directly attached to the PC boards without intermediate packaging. The companies involved in the venture are California Micro Devices, Flip Chip Technologies, and Avex Electronics.

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