Intel to build 12-inch wafer fab
By Staff -- Purchasing, 3/23/2000
Intel has announced it will build a $2-billion fab in Chandler, Ariz., that will make chips from 12-inch wafers. Most chips are made on 8-inch wafers, but chip companies are slowly moving to the larger platters.The project is contingent upon local governmental approval, expected in the next few weeks.
The 12-inch wafer offers 225% of the silicon surface area (over twice as much surface area) and about 240% of the printed die (individual computer chips) per wafer, relative to standard 8-inch wafers used in many semiconductor manufacturing plants today. In addition, the larger wafers will reduce manufacturing costs per wafer by more than 30%. The plant will initially begin production using Intel's 0.13-micron process technology with copper metallization on 200-mm wafers in 2001 and transition into the production of 300-mm wafers.
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