Lead-free conversion update

Staff -- Purchasing, 1/13/2005

The switch is on

The conversion to lead-free parts and manufacturing processes in electronics is well under way and many major OEMs plan to convert to lead-free solder and components during the first three quarters of 2005.

That such a transition is well underway was evident at the recent lead-free summit held by the National Electronics Manufacturing Initiative. The recurring theme of the presentations by electronics companies was how to roll out programs to meet the Restriction on the Use of Hazardous Substances (RoHS) directive. The law, which goes into effect July 2006, bans the use of lead in electronics equipment sold in Europe.

It's a conversion schedule that much of the supply chain is prepared to support. Indeed, even manufacturers of high-end products that are exempt from RoHS regulations plan to convert to lead-free components in 2005 and then convert to lead-free solder at a later date.

Critically, all major OEMs are requiring new part numbers for lead-free components in order to clearly differentiate "leaded" parts from lead-free.

Summit attendees were also told that it is essential to have high-level executive support to implement such programs, and a project manager to develop an implementation plan that includes in-house efforts as well as support of suppliers.

Most buyers are aware of the European Union's RoHS law that will ban the use of lead in electronics equipment. However, many buyers aren't as aware that other substances are included in the legislation or that there are noteworthy exemptions to the law.

Beside lead, the legislation bans the use of mercury, cadmium, hexavalent chromium, polybrominated biphenyls, or polybrominated ethers.

Exemptions in the law include lead used in glass for cathode ray tubes or fluorescent tubes; lead in solders for servers, storage and storage array systems; and lead in networking infrastructure equipment for switching and transmission.