Future, Tundra ink deal
By Jim Carbone, Executive Editor, Electronics, Purchasing Magazine -- Purchasing, 6/1/2006
Tundra Semiconductor and Future Electronics have signed a new distribution agreement for North and South America.
Under the deal, Future will promote and supply Tundra products throughout the Americas and expand product access and support options for customers in the region. Building on relationships established in Africa, Asia, Europe and the Middle East, this agreement now extends the partnership to provide seamless global customer support.The partnership blends Tundra’s System Interconnect portfolio with Future’s regional strength, technical resources and portfolio of complementary product lines, such as Freescale Semiconductor products. Tundra’s host bridges for PowerPC are companion chips for Freescale Semiconductor’s high performance PowerPC processors."We are confident of the potential surrounding this expanded partnership with Tundra," says Gerry Duggan, president and COO of Future.
View All Blogs
