Memory IC manufacturer Qimonda says it will transition more DRAM manufacturing from 200mm wafers to 300mm wafers, adding that the share of its 300mm capacity will reach 90% by the end of the current fiscal year. At its Richmond, Va., facility the number of 200mm wafer starts will be reduced by approximately 15% as it switches from 110nm process technology to 80nm technology. At its Dresden, Germany site, Qimonda will discontinue the contract manufacturing of 200mm Qimonda products by Infineon Dresden.